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dc.contributor.authorTarntair, FGen_US
dc.contributor.authorHong, WKen_US
dc.contributor.authorKu, TKen_US
dc.contributor.authorShe, NJen_US
dc.contributor.authorChen, CFen_US
dc.contributor.authorCheng, HCen_US
dc.date.accessioned2014-12-08T15:45:45Z-
dc.date.available2014-12-08T15:45:45Z-
dc.date.issued2000-02-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.39.432en_US
dc.identifier.urihttp://hdl.handle.net/11536/30783-
dc.description.abstractVarious types of ultra sharp Si microtips and multitips with carbon-clading films were fabricated by microwave plasma chemical vapor deposition (MPCVD). The radii of these Si tips prepared by bias assisted carburization (BAC) can he reduced below 300 Angstrom under a low deposition temperature (<550 degrees C). Field emission characterization was performed in a high vacuum environment. With an applied anode voltage of 1100 V, emission currents of 169 mu A, 198 mu A, and 385 mu A can be achieved from an array of 50 x 50 BAG-clad Si monotips, Si multitips via high bias, and Si multitips via the Ar presputtering technique, respectively. Both the auger electron spectroscopy (AES) and X-ray photo-electron spectroscopy (XPS) studies of the C l s peak suggest that the BAC-cladding is more likely to be a carbon-rich SiC layer or a SiC layer mixed with a small amount of diamond nuclei. This BAC-carbon can be used as an effective nucleation layer for further diamond nuclei. Due to the low field emission, low temperature, and large area growth capability, the sharp BAC-clad Si multitip field emitter arrays are attractive Tor flat panel display applications.en_US
dc.language.isoen_USen_US
dc.subjectfield emissionen_US
dc.subjectbias assisted carburizationen_US
dc.subjectSi multitipsen_US
dc.subjectmicrowave CVDen_US
dc.subjectemitter arrayen_US
dc.subjectdiamond clad Si tipsen_US
dc.titleFabrication and characterization of various carbon-clad silicon microtips with ultra-small tip radiien_US
dc.typeArticleen_US
dc.identifier.doi10.1143/JJAP.39.432en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERSen_US
dc.citation.volume39en_US
dc.citation.issue2Aen_US
dc.citation.spage432en_US
dc.citation.epage437en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000087538500016-
dc.citation.woscount1-
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