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dc.contributor.authorChang, C. M.en_US
dc.contributor.authorChung, Steve S.en_US
dc.contributor.authorHsieh, Y. S.en_US
dc.contributor.authorCheng, L. W.en_US
dc.contributor.authorTsai, C. T.en_US
dc.contributor.authorMa, G. H.en_US
dc.contributor.authorChien, S. C.en_US
dc.contributor.authorSun, S. W.en_US
dc.date.accessioned2014-12-08T15:45:54Z-
dc.date.available2014-12-08T15:45:54Z-
dc.date.issued2008en_US
dc.identifier.isbn978-1-4244-2377-4en_US
dc.identifier.urihttp://hdl.handle.net/11536/30865-
dc.description.abstractA new method, called gate current Random Telegraph Noise (I(G) RTN), was developed to analyze the oxide quality and reliability of high-k gate dielectric MOSFETs. First, a single electron trapping/detrapping from process induced trap in nMOSFET was observed and the associated physical mechanism was proposed. Secondly, I(G) RTN has also been successfully applied to differentiate the difference in electron tunneling mechanism for a device under high-field or low-field stress. Finally, the soft-breakdown (SBD) behavior of a device can be clearly identified. Its I(G) RTN characteristic is different from that before soft-breakdown. It was found that SBD will indeed induce extra leakage current as a result of an additional breakdown path.en_US
dc.language.isoen_USen_US
dc.titleThe Observation of Trapping and Detrapping Effects in High-k Gate Dielectric MOSFETs by a New Gate Current Random Telegraph Noise (I(G)-RTN) Approachen_US
dc.typeArticleen_US
dc.identifier.journalIEEE INTERNATIONAL ELECTRON DEVICES MEETING 2008, TECHNICAL DIGESTen_US
dc.citation.spage787en_US
dc.citation.epage790en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000265829300183-
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