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dc.contributor.authorChao, TSen_US
dc.contributor.authorChang, SJen_US
dc.contributor.authorChien, CHen_US
dc.contributor.authorLin, HCen_US
dc.contributor.authorHuang, TYen_US
dc.contributor.authorChang, CYen_US
dc.date.accessioned2014-12-08T15:46:00Z-
dc.date.available2014-12-08T15:46:00Z-
dc.date.issued1999-12-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.38.L1366en_US
dc.identifier.urihttp://hdl.handle.net/11536/30940-
dc.description.abstractThe combined effects of N-2-implantation at S/D extension and N2O oxide on 0.18 mu m n- and p-Metal oxide field effect transistors (MOSFETs) were investigated. It is found that for n-channel transistors, V-th roll-off and drain-induced barrier lowering (DIBL) are enhanced by nitrogen incorporation through either N2O oxide or N-2-implantatian. However, for p-channel transistors, apposite trends are observed for N2O oxide and N-2-implantation. Finally, nitrogen incorporation by either method is found to improve the interface quality for nMOSFETs. While for p-channel transistors, best results are obtained by the combined effects of N2O oxide and N-2-implantation.en_US
dc.language.isoen_USen_US
dc.subjectnitrogenen_US
dc.subjectN2Oen_US
dc.subjectMOSFETsen_US
dc.subjectS/D extensionen_US
dc.titleThe combined effects of nitrogen implantation at S/D extension and N2O oxide on 0.18 mu m N- and P-metal oxide field effect transistors (MOSFETs)en_US
dc.typeArticleen_US
dc.identifier.doi10.1143/JJAP.38.L1366en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERSen_US
dc.citation.volume38en_US
dc.citation.issue12Aen_US
dc.citation.spageL1366en_US
dc.citation.epageL1368en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000084451100005-
dc.citation.woscount0-
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