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dc.contributor.authorLuo, JSen_US
dc.contributor.authorHuang, JCen_US
dc.contributor.authorLin, WTen_US
dc.contributor.authorChang, CYen_US
dc.contributor.authorShih, PSen_US
dc.date.accessioned2014-12-08T15:46:02Z-
dc.date.available2014-12-08T15:46:02Z-
dc.date.issued1999-11-29en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://hdl.handle.net/11536/30951-
dc.description.abstractThe effects of Mo-free C40 Ti(Si1-xGex)(2) precursors and the thickness of an interposed Mo layer between Ti films and Si0.76Ge0.24 substrates on the lowering of formation temperature of C54 Ti(Si1-xGex)(2) were studied. Metastable C40 Ti(Si1-xGex)(2) precursors were grown by pulsed KrF laser annealing. Upon rapid thermal annealing, the Mo-free C40 phase could not be directly transformed to the C54 phase without going through the C49 phase. When the thickness of the interposed Mo layer increased, up to 2.5 nm, the temperature at which the C54 phase was initially formed changed from 750 to 600 and then to 650 degrees C. The present result showed that with increasing Mo concentration in the reacted layer, the phase stability shifted from C54 to C40 and no C49 was observed. It seems that apart from the C40 template mechanism, the electron/atom ratio also plays an important role in the enhanced formation of the C54 phase. (C) 1999 American Institute of Physics. [S0003-6951(99)02048-3].en_US
dc.language.isoen_USen_US
dc.titleEffects of Mo-free C40Ti(Si1-xGex)(2) precursors and the thickness of an interposed Mo layer on the enhanced formation of C54Ti(Si1-xGex)(2)en_US
dc.typeArticleen_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume75en_US
dc.citation.issue22en_US
dc.citation.spage3482en_US
dc.citation.epage3484en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000083845800016-
dc.citation.woscount5-
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