完整後設資料紀錄
DC 欄位語言
dc.contributor.authorChen, LCen_US
dc.contributor.authorChen, KHen_US
dc.contributor.authorWei, SLen_US
dc.contributor.authorKichambare, PDen_US
dc.contributor.authorWu, JJen_US
dc.contributor.authorLu, TRen_US
dc.contributor.authorKuo, CTen_US
dc.date.accessioned2014-12-08T15:46:05Z-
dc.date.available2014-12-08T15:46:05Z-
dc.date.issued1999-11-01en_US
dc.identifier.issn0040-6090en_US
dc.identifier.urihttp://dx.doi.org/10.1016/S0040-6090(99)00490-3en_US
dc.identifier.urihttp://hdl.handle.net/11536/30993-
dc.description.abstractGrowth and mechanical properties of SiCN materials prepared by microwave plasma enhanced chemical vapor deposition (CVD) as well as electron cyclotron resonance plasma CVD are reported. Large (several tens of microns), well-faceted ternary SiCN crystals were grown by microwave plasma-enhanced chemical vapor deposition. whereas amorphous SiCN films were deposited by ECR-CVD. The ternary crystalline compound (C; Si)(x)N-y exhibits a hexagonal structure and consists of a network wherein the Si and C are substitutional elements. While the N content of the crystalline compound is about 50 at.%, the extent of Si substitution varies and can be as low as 10 at.%. The amorphous SIGN films contain only about 30 at.% N. Nano-indentation studies were employed to investigate the mechanical properties of the SiCN materials. From the load versus displacement curves. we estimated the hardness and the effective modulus of the SIGN crystals to be around 30 and 321.7 GPa, respectively. The corresponding values for the amorphous SiCN were around 22 and 164.4 GPa, respectively. These values are well above most reported values for CN films. (C) 1999 Elsevier Science S.A. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectcrystalline SiCNen_US
dc.subjectcubic BNen_US
dc.subjectchemical vapor depositionen_US
dc.subjectgrowth and mechanical propertiesen_US
dc.titleCrystalline SiCN: a hard material rivals to cubic BNen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/S0040-6090(99)00490-3en_US
dc.identifier.journalTHIN SOLID FILMSen_US
dc.citation.volume355en_US
dc.citation.issueen_US
dc.citation.spage112en_US
dc.citation.epage116en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000084500800019-
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