完整後設資料紀錄
DC 欄位語言
dc.contributor.authorTsai, MSen_US
dc.contributor.authorSun, SCen_US
dc.contributor.authorTseng, TYen_US
dc.date.accessioned2014-12-08T15:46:14Z-
dc.date.available2014-12-08T15:46:14Z-
dc.date.issued1999-09-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/16.784181en_US
dc.identifier.urihttp://hdl.handle.net/11536/31101-
dc.description.abstractThe dielectric constant and the leakage current density of (Ba, Sr)TiO3 (BST) thin films deposited on various bottom electrode materials (Pt, Ir. IrO2/Ir, Ru, RuO2/Ru) before and after annealing in O-2 ambient were investigated. The improvement of crystallinity of BST films deposited on various bottom electrodes was observed after the postannealing process, The dielectric constant and leakage current of the films were also strongly dependent on the postannealing conditions. BST thin film deposited on Ir bottom electrode at 500 degrees C, after 700 degrees C annealing in O-2 for 20 min, has the dielectric constant of 593, a loss tangent of 0.019 at 100 kHz, a leakage current density of 1.9 x 10(-8) A/cm(2) at an electric field of 200 kV/cm with a delay time of 30 s, and a charge storage density of 53 fC/mu m(2) at an applied field of 100 kV/cm, The BST films deposited on Ir with post-annealing can obtain better dielectric properties than on other bottom electrodes in our experiments, And Ru electrode is unstable because the interdiffusion of Ru and Ti occurs at the interface between the BST and Ru after postannealing. The ten-year lifetime of time-dependent dielectric breakdown (TDDB) studies indicate that BST on Pt, Ir, IrO2/Ir, Ru, and RuO2/Ru have long lifetimes over ten years on operation at the voltage bias of 2 V.en_US
dc.language.isoen_USen_US
dc.subject(Ba, Sr)TiO3en_US
dc.subjectelectrodeen_US
dc.subjectelectrical propertiesen_US
dc.subjectreliabilityen_US
dc.subjectthin film capacitorsen_US
dc.titleEffect of bottom electrode materials on the electrical and reliability characteristics of (Ba, Sr)TiO3 capacitorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/16.784181en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume46en_US
dc.citation.issue9en_US
dc.citation.spage1829en_US
dc.citation.epage1838en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000082242500003-
dc.citation.woscount65-
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