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dc.contributor.authorTyan, HLen_US
dc.contributor.authorLiu, YCen_US
dc.contributor.authorWei, KHen_US
dc.date.accessioned2014-12-08T15:46:26Z-
dc.date.available2014-12-08T15:46:26Z-
dc.date.issued1999-07-01en_US
dc.identifier.issn0897-4756en_US
dc.identifier.urihttp://hdl.handle.net/11536/31251-
dc.description.abstractHigh modulus and thermally stable clay/polyimide (pyromellitic dianhydride-4,4'-oxydianiline, PMDA-ODA) nanocomposites were synthesized from reactive organoclay and poly(amic acid). The reactive organoclay was formed by using p-phenylenediamine as a swelling agent for silicate layers of montmorillonite. The swelling process was first carried out through ion exchange between the onium of one amine end group of p-phenylenediamine and the sodium ion in montmorillonite. The other amine end group of p-phenylenediamine reacted with the dianhydride end group of poly(amic acid), producing an irreversible swelling. This irreversible swelling resulted in a nanostructured material containing intercalated nanometer silicate layers dispersed in PMDA-ODA as confirmed by both X-ray and transmission electron microscopy. The glass transition temperature and the thermal decomposition temperatures of this type of clay/PMDA-ODA are higher than that of pure PMDA-ODA. A 2,5-fold increase in the modulus of clay/PMDA-ODA film was obtained as compared to that of pure PMDA-ODA film. Both the maximum and the elongation-for-break of these clay/PMDA-ODA nanocomposites increased with the amount of organoclay. The maximum reduction in out-of-plane coefficient of thermal expansion of this type clay/PMDA-ODA was 50% as compared to that of pure PMDA-ODA.en_US
dc.language.isoen_USen_US
dc.titleThermally and mechanically enhanced clay/polyimide nanocomposite via reactive organoclayen_US
dc.typeArticleen_US
dc.identifier.journalCHEMISTRY OF MATERIALSen_US
dc.citation.volume11en_US
dc.citation.issue7en_US
dc.citation.spage1942en_US
dc.citation.epage1947en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000081626800040-
dc.citation.woscount256-
Appears in Collections:Articles


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