完整後設資料紀錄
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dc.contributor.authorPan, CSen_US
dc.contributor.authorHsu, WYen_US
dc.date.accessioned2014-12-08T15:46:30Z-
dc.date.available2014-12-08T15:46:30Z-
dc.date.issued1999-06-01en_US
dc.identifier.issn1057-7157en_US
dc.identifier.urihttp://dx.doi.org/10.1109/84.767116en_US
dc.identifier.urihttp://hdl.handle.net/11536/31289-
dc.description.abstractThis work presents a new strain sensor with a compact structure. The strain sensor comprises of a pair of cantilever beams with different lengths connected by a short tip. The residual strain causes two beams to deflect each other, thereby magnifying the deflection, which is measured by the tip. The displacement is independent of both Young's modulus and the film's thickness. An analytical model is derived to relate the measured displacement to residual strain. Finite-element modeling is also used to analyze the model. This work also thoroughly considers other factors that influence the designs and the implicit limitations of the strain sensors. Experimental results with an SiO2 film as well as undoped LPCVD polysilicon films are used to demonstrate the effectiveness of the proposed structure.en_US
dc.language.isoen_USen_US
dc.subjectresidual strainen_US
dc.subjectthin filmen_US
dc.titleA microstructure for in situ determination of residual strainen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/84.767116en_US
dc.identifier.journalJOURNAL OF MICROELECTROMECHANICAL SYSTEMSen_US
dc.citation.volume8en_US
dc.citation.issue2en_US
dc.citation.spage200en_US
dc.citation.epage207en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000080737300009-
dc.citation.woscount24-
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