Full metadata record
DC FieldValueLanguage
dc.contributor.authorLin, CMen_US
dc.contributor.authorLoong, WAen_US
dc.date.accessioned2014-12-08T15:46:39Z-
dc.date.available2014-12-08T15:46:39Z-
dc.date.issued1999-05-01en_US
dc.identifier.issn0167-9317en_US
dc.identifier.urihttp://dx.doi.org/10.1016/S0167-9317(99)00023-4en_US
dc.identifier.urihttp://hdl.handle.net/11536/31374-
dc.description.abstractTiSixNy and TiSixOyNz were presented as new embedded materials for APSM in 193 nm lithography. TiSixNy films were formed by plasma sputtering of Ti (180 similar to 230 W) and Si (60 similar to 80 W) under Ar (50 seem) and nitrogen (4 similar to 6 seem). For required phase shift degree theta = 180 degrees, the calculated thickness d(180) of TiSixNy film is 82 similar to 93 nm. TiSixOyNz films were formed by plasma sputtering of Ti (200 similar to 240 W) and Si (60 similar to 80 W) under Ar (50 sccm), nitrogen (4 similar to 6 seem) and oxygen (0.2 similar to 0.7 seem). The d(180) of TiSixOyNz film is 92 similar to 105 nm. With the thickness d(180), the transmittance at visible wavelength (488, 632.8 nm) for optical alignment is 35 similar to 50% for TiSixNy and TiSixOyNz. Under BCl3:Cl-2=14:70 seem; chamber pressure 4 mtorr and RF power 1900 W, the dry etching selectivity of TiSixNy over DQN positive resist and fused silica, were found to be 2:1 and 4.8.1, respectively. A TiSixNy embedded layer with 0.6 mu m lines/space was successfully patterned.en_US
dc.language.isoen_USen_US
dc.titleTiSixNy and TiSixOyNz as embedded materials for attenuated phase-shifting mask in 193 nmen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/S0167-9317(99)00023-4en_US
dc.identifier.journalMICROELECTRONIC ENGINEERINGen_US
dc.citation.volume46en_US
dc.citation.issue1-4en_US
dc.citation.spage93en_US
dc.citation.epage96en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department應用化學系zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Applied Chemistryen_US
dc.identifier.wosnumberWOS:000080952500021-
Appears in Collections:Conferences Paper


Files in This Item:

  1. 000080952500021.pdf

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.