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dc.contributor.authorHuang, CLen_US
dc.contributor.authorHuang, YHen_US
dc.contributor.authorChang, TYen_US
dc.contributor.authorChang, SHen_US
dc.contributor.authorChung, CHen_US
dc.contributor.authorHuang, DTen_US
dc.contributor.authorLi, RKen_US
dc.date.accessioned2014-12-08T15:46:42Z-
dc.date.available2014-12-08T15:46:42Z-
dc.date.issued1999-04-15en_US
dc.identifier.issn0020-7543en_US
dc.identifier.urihttp://hdl.handle.net/11536/31396-
dc.description.abstractThe major performance measurements for wafer fabrication system comprise WIP level, throughput and cycle time. These measurements are influenced by various factors, including machine breakdown, operator absence, poor dispatching rules, emergency order and material shortage. Generally, production managers use the WIP level profile of each stage to identify an abnormal situation, and then make corrective actions. However, such a measurement is reactive, not proactive. Proactive actions must effectively predict the future performance, analyze the abnormal situation, and then generate corrective actions to prevent performance from degrading. This work systematically constructs artificial neural network models to predict production performances for a semiconductor manufacturing factory. An application for a local DRAM wafer fabrication has demonstrated the accuracy of neural network models in predicting production performances.en_US
dc.language.isoen_USen_US
dc.titleThe construction of production performance prediction system for semiconductor manufacturing with artificial neural networksen_US
dc.typeArticleen_US
dc.identifier.journalINTERNATIONAL JOURNAL OF PRODUCTION RESEARCHen_US
dc.citation.volume37en_US
dc.citation.issue6en_US
dc.citation.spage1387en_US
dc.citation.epage1402en_US
dc.contributor.department工業工程與管理學系zh_TW
dc.contributor.departmentDepartment of Industrial Engineering and Managementen_US
dc.identifier.wosnumberWOS:000079497600012-
dc.citation.woscount22-
Appears in Collections:Articles


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