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dc.contributor.authorChen, LCen_US
dc.contributor.authorChen, FRen_US
dc.contributor.authorKai, JJen_US
dc.contributor.authorChang, Len_US
dc.contributor.authorHo, JKen_US
dc.contributor.authorJong, CSen_US
dc.contributor.authorChiu, CCen_US
dc.contributor.authorHuang, CNen_US
dc.contributor.authorChen, CYen_US
dc.contributor.authorShih, KKen_US
dc.date.accessioned2014-12-08T15:47:13Z-
dc.date.available2014-12-08T15:47:13Z-
dc.date.issued1999-01-01en_US
dc.identifier.isbn0-7503-0650-5en_US
dc.identifier.issn0951-3248en_US
dc.identifier.urihttp://hdl.handle.net/11536/31680-
dc.description.abstractThe phase evolution of oxidized (10nm) Ni/(5nm) Au films on p-GaN was examined with a field emission gun transmission electron microscope in conjunction with composition analyses to explore the mechanism of formation of low resistance ohmic contact to p-GaN. The p-GaN/Ni/Au sample heat treated above 500 degreesC in air was mainly composed of a mixture of crystalline NiO, Au and amorphous Ni-Ga-O phases. Small voids adjacent to the p-GaN film were also found. Moreover, NiO partially contacts to p-GaN as well as Au islands and the amorphous Ni-Ga-O phases. The results suggest that the crystalline NiO and/or amorphous Ni-Ga-O phases may play a significant role in the formation of a low resistance ohmic contact to p-GaN.en_US
dc.language.isoen_USen_US
dc.titleMicrostructural investigation of oxidized Ni/Au ohmic contact to p-type GaNen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.journalMICROSCOPY OF SEMICONDUCTING MATERIALS 1999, PROCEEDINGSen_US
dc.citation.volumeen_US
dc.citation.issue164en_US
dc.citation.spage561en_US
dc.citation.epage565en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000166835300122-
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