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dc.contributor.authorChang, KMen_US
dc.contributor.authorLee, TCen_US
dc.contributor.authorSun, YLen_US
dc.date.accessioned2014-12-08T15:47:19Z-
dc.date.available2014-12-08T15:47:19Z-
dc.date.issued1998-12-01en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://hdl.handle.net/11536/31735-
dc.description.abstractThis work proposes a new method for growing the polyoxide and investigates its characteristics. Thin amorphous silicon was deposited on the first polysilicon and then recrystallized at 600 degrees C for 24 h to form a new polysilicon. The N2O-grown polyoxide formed by this method has a higher conduction current and better stress endurance than those of the conventional polyoxide. The higher quality polyoxide, as measured by lower gate voltage shift and larger charge-to-breakdown (Q(bd)), is due to the smooth polyoxide/polysilicon interface which increases the stress endurance under high fields. (C) 1998 The Electrochemical Society. S1099-0062(98)06-105-7. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleCharacteristics of N2O-grown polyoxide by the recrystallized-polysilicon methoden_US
dc.typeArticleen_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume1en_US
dc.citation.issue6en_US
dc.citation.spage274en_US
dc.citation.epage275en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000079696400013-
dc.citation.woscount7-
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