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dc.contributor.authorLin, CRen_US
dc.contributor.authorKuo, CTen_US
dc.date.accessioned2014-12-08T15:47:23Z-
dc.date.available2014-12-08T15:47:23Z-
dc.date.issued1998-11-10en_US
dc.identifier.issn0257-8972en_US
dc.identifier.urihttp://hdl.handle.net/11536/31760-
dc.description.abstractThe growth and surface modification of irregular diamond grains of electroplated diamond tools have been developed successfully. Results show that the adherence, cutting ability, and wear resistance of diamond grains are improved by this process. In this study, the crystallization and quality of diamond grains were determined by SEM (SE and BSE), Raman spectroscopy, and XRD determination. Tests using a block-on-ring tribotester were also carried out to examine the adherence, cutting ability, and wearing resistance of the electroplated diamond tools, The adherence of diamond grains was also observed on a SEM microphotograph of the cross-section view of specimens. SEM line scanning was performed to determine whether the alloy elements are effectual in promoting the diffusion bonding strength among diamonds, the interlayer and substrate. (C) 1998 Elsevier Science S.A. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectelectroplated diamond toolsen_US
dc.subjectmicrowave plasma CVD diamond processen_US
dc.titleImprovement of mechanical properties of electroplated diamond tools by microwave plasma CVD diamond processen_US
dc.typeArticleen_US
dc.identifier.journalSURFACE & COATINGS TECHNOLOGYen_US
dc.citation.volume110en_US
dc.citation.issue1-2en_US
dc.citation.spage19en_US
dc.citation.epage23en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000077307600004-
dc.citation.woscount12-
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