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dc.contributor.authorChang, W. R.en_US
dc.contributor.authorChen, C. A.en_US
dc.contributor.authorKe, J. H.en_US
dc.contributor.authorLin, T. F.en_US
dc.date.accessioned2014-12-08T15:47:56Z-
dc.date.available2014-12-08T15:47:56Z-
dc.date.issued2010-11-01en_US
dc.identifier.issn0017-9310en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.ijheatmasstransfer.2010.05.014en_US
dc.identifier.urihttp://hdl.handle.net/11536/32002-
dc.description.abstractExperiments are conducted here to investigate subcooled flow boiling heat transfer and associated bubble characteristics of FC-72 on a heated micro-pin-finned silicon chip flush-mounted on the bottom of a horizontal rectangular channel. In the experiments the mass flux is varied from 287 to 431 kg/m(2) s, coolant inlet subcooling from 2.3 to 4.3 degrees C, and imposed heat flux from 1 to 10 W/cm(2). Besides, the silicon chips contain three different geometries of micro-structures, namely, the smooth, pin-finned 200 and pin-finned 100 surfaces. The pin-finned 200 and 100 surfaces, respectively, contain micro-pin-fins of size 200 mu m x 200 mu m x 70 mu m (width x length x height) and 100 mu m x 100 mu m x 70 mu m. The measured data show that the subcooled flow boiling heat transfer coefficient is reduced at increasing inlet liquid subcooling but is little affected by the coolant mass flux. Besides, adding the micro-pin-fin structures to the chip surface can effectively raise the single-phase convection and flow boiling heat transfer coefficients. Moreover, the mean bubble departure diameter and active nucleation site density are reduced for rises in the FC-72 mass flux and inlet liquid subcooling. Increasing coolant mass flux or reducing inlet liquid subcooling results in a higher mean bubble departure frequency. Furthermore, larger bubble departure diameter, higher bubble departure frequency, and higher active nucleation site density are observed as the imposed heat flux is increased. Finally, empirical correlations for the present data for the heat transfer and bubble characteristics in the FC-72 subcooled flow boiling are proposed. (C) 2010 Published by Elsevier Ltd.en_US
dc.language.isoen_USen_US
dc.subjectSubcooled flow boilingen_US
dc.subjectFC-72en_US
dc.subjectMicro-pin-finsen_US
dc.subjectBubble characteristicsen_US
dc.titleSubcooled flow boiling heat transfer and associated bubble characteristics of FC-72 on a heated micro-pin-finned silicon chipen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.ijheatmasstransfer.2010.05.014en_US
dc.identifier.journalINTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFERen_US
dc.citation.volume53en_US
dc.citation.issue23-24en_US
dc.citation.spage5605en_US
dc.citation.epage5621en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000282155900061-
dc.citation.woscount4-
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