統計資料
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| Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump metallization | 109 |
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| Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump metallization | 0 | 0 | 0 | 0 | 0 | 1 | 0 |
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