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dc.contributor.authorCHEN, JLen_US
dc.contributor.authorHUANG, THen_US
dc.contributor.authorPAN, FMen_US
dc.contributor.authorKUO, CTen_US
dc.contributor.authorCHANG, CSen_US
dc.contributor.authorLIN, TSen_US
dc.date.accessioned2014-12-08T15:04:44Z-
dc.date.available2014-12-08T15:04:44Z-
dc.date.issued1992-11-23en_US
dc.identifier.issn0257-8972en_US
dc.identifier.urihttp://hdl.handle.net/11536/3227-
dc.description.abstractDiamond films were deposited on cemented WC substrates using a hot filament chemical vapor deposition (CVD) system with a mixture of CH4 and H-2 as the source gases. The effect of the surface pretreatments of scratching the surface and etching to remove the surface Co from the substrate on diamond nucleation and growth was studied. The effect of CH4 Concentration on diamond growth was also examined. Scanning electron microscopy, Auger electron, X-ray photoelectron and energy dispersive spectroscopies were used to examine the film morphology, quality and compositions. The results show that a good diamond-crystal quality can be obtained by reducing the surface Co content in the substrate to below 1%. Co in the surface layer of the substrate inhibits both diamond nucleation and growth. Polishing and etching treatments to scratch the surface and to remove the surface Co of the substrates are essential to maintain the surface roughness in an appropriate range to obtain diamond films with a good quality and adhesion. A change in CH4 Concentration in the source gases from 0.5 to 0.15% can change the preferred orientation of the diamond films fro m the {100} to the {111} plane.en_US
dc.language.isoen_USen_US
dc.titleDIAMOND FILM GROWTH ON CEMENTED TUNGSTEN CARBIDES STUDIED BY SEM, AES AND XPSen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.journalSURFACE & COATINGS TECHNOLOGYen_US
dc.citation.volume55en_US
dc.citation.issue1-3en_US
dc.citation.spage392en_US
dc.citation.epage396en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:A1992KA63900008-
Appears in Collections:Conferences Paper