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dc.contributor.authorYang, Hanpingen_US
dc.contributor.authorFan, Shib-Kangen_US
dc.contributor.authorHsu, Wensyangen_US
dc.date.accessioned2014-12-08T15:48:48Z-
dc.date.available2014-12-08T15:48:48Z-
dc.date.issued2008en_US
dc.identifier.isbn978-0-8194-7061-4en_US
dc.identifier.issn0277-786Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/32464-
dc.identifier.urihttp://dx.doi.org/10.1117/12.765652en_US
dc.description.abstractHere, interconnection technique to link digital microfluidic chips is proposed. Three kinds of digital microfluidic modules with connecting interface, including flexible module and two types of connector modules, are designed and fabricated. Since these modules are fabricated on a compliant polymer-based substrate (ITO PET), chip-to-chip droplet transportation even at different planes can be achieved by the proposed technique. A low-temperature fabrication process is developed for the polymer substrates, where the SU-8 acts as the insulator. Droplet transportation through electrowetting on curved surface is confirmed by testing on the bended flexible modules with different curvatures from 0 to 0.06 mm(-1) at around 70 V-AC. Then the droplet transportations between flexible and connector modules are investigated. It is found that the gap size between two modules and the sidewall profiles at interface affect the droplet transportation directly. For the gap size around 50 mu m with a smooth perpendicular sidewall profile, 80 V-AC is shown to actuate droplet of 1.5 mu l, 2.5 mu l, or 3.5 mu l to cross over the interface successfully.en_US
dc.language.isoen_USen_US
dc.subjectdigital microfluidicsen_US
dc.subjectelectrowettingen_US
dc.subjectflexibleen_US
dc.subjectconnectoren_US
dc.titleConnecting interface for modularization of digital microfluidics - art. no. 68860Len_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1117/12.765652en_US
dc.identifier.journalMICROFLUIDICS, BIOMEMS, AND MEDICAL MICROSYSTEMS VIen_US
dc.citation.volume6886en_US
dc.citation.spageL8860en_US
dc.citation.epageL8860en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000255942400019-
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