Title: Comparison of N-2 and NH3 plasma passivation effects on polycrystalline silicon thin-film transistors
Authors: Lee, YS
Lin, HY
Lei, TF
Huang, TY
Chang, TC
Chang, CY
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
Keywords: thin-film transistor;poly-Si TFT;N-2 plasma passivation;NH3 plasma passivation;hot-carrier reliability
Issue Date: 1-Jul-1998
Abstract: The passivation effects of pure N-2 plasma on polycrystalline silicon (poly-Si) thin-film transistors (TFTs) have been studied and compared with those of NH3 plasma. We found that, similar to the recently-proposed NH3 plasma passivation, N-2 plasma passivation can also effectively improve device parameters such as field effect mobility, threshold voltage subthreshold swing, off current, and on/off current ratio. While the improvement of NH3-passivated devices can be attributed to both hydrogen and nitrogen passivation effects, nitrogen passivation alone is mainly responsible for the improvement of N-2-passivated devices. Zn addition, we round that N-2-passivated devices exhibit much better hot-carrier reliability than NH3-passivated devices. The better hot-carrier reliability of N-2-passivated devices can be explained by the formation of strong Si-N bonds which are difficult to break, while effectively eliminating the weaker N-H bonds, which are inevitable in NH3-passivated devices. The results of a Fourier. transform infrared (FTIR) spectrum analysis performed in this study are consistent with this proposition.
URI: http://hdl.handle.net/11536/32526
ISSN: 0021-4922
Journal: JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
Volume: 37
Issue: 7
Begin Page: 3900
End Page: 3903
Appears in Collections:Articles


Files in This Item:

  1. 000075363300007.pdf

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.