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dc.contributor.authorJUANG, JYen_US
dc.contributor.authorWANG, SJen_US
dc.contributor.authorUEN, TMen_US
dc.contributor.authorGOU, YSen_US
dc.contributor.authorCHANG, HLen_US
dc.contributor.authorWANG, Cen_US
dc.date.accessioned2019-04-03T06:37:33Z-
dc.date.available2019-04-03T06:37:33Z-
dc.date.issued1992-07-01en_US
dc.identifier.issn1098-0121en_US
dc.identifier.urihttp://dx.doi.org/10.1103/PhysRevB.46.1188en_US
dc.identifier.urihttp://hdl.handle.net/11536/3359-
dc.description.abstractThe scaling behaviors of global pinning force density (F(p) = J(c) X B) in dc sputtered TI-Ba-Ca-Cu-0 superconducting thin films as functions of both the reduced magnetic field and temperature were investigated by direct transport measurements for fields up to 4 kOe. It was found that, depending on the film granularities (originating from different deposition and annealing conditions and characterized by the temperature and magnetic-field dependencies of critical currents), vastly different scaling behaviors were manifested. For films with very high critical current densities, where the intragranular behaviors prevailed, the conventional surface core pinning by some high-density normal pinning centers combined with a significant flux creep appeared to be the predominant limiting mechanisms for the critical current densities, whereas in more granular films, suggestive collective-pinning effects arising from the weakly pinned fluxoids in the intergranular networks were observed.en_US
dc.language.isoen_USen_US
dc.titleLOW-FIELD SCALING BEHAVIORS OF GLOBAL FLUX PINNING IN TL-BA-CA-CU-O THIN-FILMSen_US
dc.typeArticleen_US
dc.identifier.doi10.1103/PhysRevB.46.1188en_US
dc.identifier.journalPHYSICAL REVIEW Ben_US
dc.citation.volume46en_US
dc.citation.issue2en_US
dc.citation.spage1188en_US
dc.citation.epage1192en_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:A1992JC92200068en_US
dc.citation.woscount16en_US
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