Full metadata record
DC FieldValueLanguage
dc.contributor.authorJUANG, MHen_US
dc.contributor.authorCHENG, HCen_US
dc.date.accessioned2014-12-08T15:04:51Z-
dc.date.available2014-12-08T15:04:51Z-
dc.date.issued1992-07-01en_US
dc.identifier.issn0038-1101en_US
dc.identifier.urihttp://dx.doi.org/10.1016/0038-1101(92)90327-9en_US
dc.identifier.urihttp://hdl.handle.net/11536/3363-
dc.description.abstractThe effects of heating rate on the recrystallization and dopant activation, for samples under different implant conditions, have been studied. The as-implanted samples were annealed, at various heating rates, to different preset temperatures but zero holding time. Factors associated with the dopant activation have been evaluated to develop a proper activation mechanism, thus correlating with the experimental results. In the transient annealing, a higher heating rate facilitates the dopant activation via a lower effective activation energy, while lower heating rates inherently own longer effective activating times. Implant conditions strongly determine the degree, impacting the dopant activation, of respective factors. In addition, higher heating rates led to better Si recrystallization.en_US
dc.language.isoen_USen_US
dc.titleNOVEL EFFECTS OF HEATING RATE ON THE ACTIVATION RECRYSTALLIZATION OF BORON-IMPLANTED SI SUBSTRATESen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/0038-1101(92)90327-9en_US
dc.identifier.journalSOLID-STATE ELECTRONICSen_US
dc.citation.volume35en_US
dc.citation.issue7en_US
dc.citation.spage969en_US
dc.citation.epage973en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1992JB92400014-
dc.citation.woscount0-
Appears in Collections:Articles