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dc.contributor.authorTsai, WCen_US
dc.contributor.authorTseng, TYen_US
dc.date.accessioned2014-12-08T15:01:31Z-
dc.date.available2014-12-08T15:01:31Z-
dc.date.issued1997-08-28en_US
dc.identifier.issn0040-6090en_US
dc.identifier.urihttp://hdl.handle.net/11536/363-
dc.description.abstractYttria-stabilized zirconia (YSZ) thin films were grown on Si by rf magnetron sputtering. Sputtering gun was positioned at various angles to the substrate normal to change the amount of plasma bombardment on the as-deposited films. YSZ films grown by off-axis sputtering (90 degrees) are readily (200)-preferred orientated but the preferred orientation of the film is deteriorated when the growth angle is decreased and, consequently, plasma bombardment is increased due to the decreasing growth angles. The off-axis grown YSZ films exhibit atomically smooth interfaces, which are not observed for those films grown by on-axis sputtering. The variation of oxide charge with the growth angle is studied with the Al/YSZ/Si structure. The plasma bombardment plays an important role on the crystallinity and, therefore, the defect type of the films and is also considered to be responsible for the Si outdiffusion occurring in an on-axis grown film. (C) 1997 Elsevier Science S.A.en_US
dc.language.isoen_USen_US
dc.subjectyttria-stabilized zirconiaen_US
dc.subjectmagnetron sputteringen_US
dc.subjectplasma bombardmenten_US
dc.subjectthin filmsen_US
dc.titleCharacterization of yttria-stabilized zirconia thin films grown by planar magnetron sputteringen_US
dc.typeArticleen_US
dc.identifier.journalTHIN SOLID FILMSen_US
dc.citation.volume306en_US
dc.citation.issue1en_US
dc.citation.spage86en_US
dc.citation.epage91en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1997YB66700012-
dc.citation.woscount11-
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