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dc.contributor.authorLOONG, WAen_US
dc.contributor.authorCHANG, HLen_US
dc.date.accessioned2014-12-08T15:05:12Z-
dc.date.available2014-12-08T15:05:12Z-
dc.date.issued1991-07-15en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://hdl.handle.net/11536/3732-
dc.description.abstractThe optical reflectivity of a GaAs wafer is found to decrease from about 45% down to about 5% for both the g-line and i-line by oxidation in low-power oxygen plasma at 300-degrees-C for 4 hours. The oxide layer on the GaAs top surface used as an in situ antireflection layer for optical microlithography is demonstrated to be effective.en_US
dc.language.isoen_USen_US
dc.subjectGAASen_US
dc.subjectOXYGEN PLASMAen_US
dc.subjectANTIREFLECTION LAYERen_US
dc.titleOXIDATION OF GAAS SURFACE BY OXYGEN PLASMA AND ITS APPLICATION AS AN ANTIREFLECTION LAYERen_US
dc.typeArticleen_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERSen_US
dc.citation.volume30en_US
dc.citation.issue7Ben_US
dc.citation.spageL1319en_US
dc.citation.epageL1320en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department應用化學系zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Applied Chemistryen_US
dc.identifier.wosnumberWOS:A1991FY67400031-
dc.citation.woscount4-
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