Improvement of diamond film adhesion on cemented carbides (WC/Co) by using Ti and micro-diamonds as seeding germination

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Lin, CR	en_US
dc.contributor.author	Kuo, CT	en_US
dc.date.accessioned	2014-12-08T15:01:07Z	-
dc.date.available	2014-12-08T15:01:07Z	-
dc.date.issued	1998-01-06	en_US
dc.identifier.issn	1359-6462	en_US
dc.identifier.uri	http://hdl.handle.net/11536/37	-
dc.language.iso	en_US	en_US
dc.title	Improvement of diamond film adhesion on cemented carbides (WC/Co) by using Ti and micro-diamonds as seeding germination	en_US
dc.type	Article	en_US
dc.identifier.journal	SCRIPTA MATERIALIA	en_US
dc.citation.volume	38	en_US
dc.citation.issue	3	en_US
dc.citation.spage	385	en_US
dc.citation.epage	390	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000071739900005	-
dc.citation.woscount	1	-
顯示於類別：	期刊論文

文件中的檔案：

若為 zip 檔案，請下載檔案解壓縮後，用瀏覽器開啟資料夾中的 index.html 瀏覽全文。