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dc.contributor.author朱昱銘en_US
dc.contributor.authorYu-Ming Chuen_US
dc.contributor.author鍾淑馨en_US
dc.contributor.authorShu-Hsing Chungen_US
dc.date.accessioned2014-12-12T01:17:53Z-
dc.date.available2014-12-12T01:17:53Z-
dc.date.issued2007en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#GT009533537en_US
dc.identifier.urihttp://hdl.handle.net/11536/39167-
dc.description.abstract  一元化代工服務(Semiconductor backend turnkey service:SBTS),為一種新興的生產模式,其為由晶圓製造廠主導整個半導體後段生產,提供上游IC設計公司從晶圓製造、針測、封裝與最終測試的全套服務。為了使得整條半導體生產鏈能提供優質的一元化代工服務,晶圓製造廠需慎選協同生產夥伴,找出最有競爭力的協同廠組合,並妥善規劃後段代工廠之中期、短期生產規劃,以達到爭取訂單的目的。   因此,本文提出「半導體後段一元化代工服務之生產規劃模式」,模式中分別以「產量配置模組」來因應中期產能規劃問題,以「訂單分派模組」來解決短期訂單分派問題。並以此為基礎,設計「協同廠組合評估模組」以篩選出最有效率之協同廠組合。   由於半導體後段生產為多階多廠之生產環境,且各家後段代工廠之生產特性不同,各月各產品需求量不一,中期產能規劃問題因而複雜。本文之「產量配置模組」,依據每月所需各產品產能,設計以最小成本為目標之數學規劃模式,求解各代工廠之預定代工數量,使得晶圓製造廠能有適當的產能與成本,進行一元化代工服務。   在產量配置之後,晶圓製造廠在運行短期訂單分派時,需考量許多特有之生管特性,如可供客戶任意指定加工階段與製程、單階與多階代工方案之選擇、訂單之來到時間與交期時間,使得此問題成為一多期、多階、多廠、多產品、多類型訂單之訂單分派問題。「訂單分派模組」中之數學規劃模式,可使晶圓製造廠得到成本最低之生產指派結果,以滿足訂單需求。   最後,「協同廠組合評估模組」以上述兩模組為基礎,運用資料包絡分析法(Data Envelopment Analysis,DEA)針對成本、訂單完成率與因應需求變動之彈性等三項績效指標,對可行之協同廠組合進行評估,評估結果可得出最具效率之協同廠組合,以提供給晶圓製造廠作為參考。   整體而言,本文所提之半導體後段一元化代工服務之生產規劃模式,確實可以提升整體生產效率。zh_TW
dc.description.abstractThe semiconductor backend turnkey service (SBTS) provided by wafer fabricators is a new production model that help their customers to handle the outsourcing business of the three backend processing stages including circuit probing testing, integrated circuit assembly, and final testing. In order to provide high-quality SBTS, Wafer fabricators needs to select appropriate outsourcing firms and to make mid-term and short-term production plan.  This thesis proposed a production planning system for SBTS. This system contains three modules:capacity allocation module for the aggregate planning, order allocation module for short-term production planning, and outsourcing- firm mix evaluation module for select appropriate outsourcing firms. Under such a multi-stage、multi-factory environment, capacity allocation module designs a mathematical model to help SBTS providers generating the aggregate production planning with considerations of the demand information and the constraints of each outsourcing firm to generate the aggregate production planning . The order allocation problem for SBTS is very complicated because of requirement variations of orders、capability variations of outsourcing firms、due date and arrival date of order. In order allocation module, a mixed integer programming model for order allocation problem with the total cost minimization criterion is presented. Finally,the outsourcing-firm mix evaluation module uses data envelopment analysis (DEA) to evaluate and select sets of outsourcing-firm mix with the most efficiency in cost、completion rate of orders and flexibility in dynamic environment. Overall,the production planning for SBTS is capable in improving the manufacturing efficiency.en_US
dc.language.isozh_TWen_US
dc.subject半導體後段生產zh_TW
dc.subject一元化代工服務zh_TW
dc.subject資料包絡分析法zh_TW
dc.subjectsemiconductor backend productionen_US
dc.subjectSBTSen_US
dc.subjectDEAen_US
dc.title半導體後段一元化代工服務之生產規劃模式建構zh_TW
dc.titleThe Design of Production Planning for Semiconductor Backend Turnkey Serviceen_US
dc.typeThesisen_US
dc.contributor.department工業工程與管理學系zh_TW
Appears in Collections:Thesis