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dc.contributor.authorWu, KHen_US
dc.contributor.authorChen, SPen_US
dc.contributor.authorJuang, JYen_US
dc.contributor.authorUen, TMen_US
dc.contributor.authorGou, YSen_US
dc.date.accessioned2014-12-08T15:01:33Z-
dc.date.available2014-12-08T15:01:33Z-
dc.date.issued1997-08-01en_US
dc.identifier.issn0921-4534en_US
dc.identifier.urihttp://dx.doi.org/10.1016/S0921-4534(97)00378-Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/393-
dc.description.abstractThe detailed grain evolution of (103)-oriented YBa2Cu3O7 (YBCO) films grown on as-polished and preannealed (110)SrTiO3 was studied using atomic force microscopy (AFM). The scanning laser deposition system used in preparing the films allows us to deposit films with various thicknesses in a single deposition run. The AFM images revealed that although more regular alignment of grains at the initial nucleation for films grown on the pre-annealed substrates, there were no apparent differences in surface structure for the thicker films grown on both as-polished and annealed substrates. It was also found that as the films increased to a critical thickness, microcracks were formed in both cases.en_US
dc.language.isoen_USen_US
dc.titleMorphology evolution and crack formation of YBa2Cu3O7 on (110)SrTiO3 substratesen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/S0921-4534(97)00378-Xen_US
dc.identifier.journalPHYSICA Cen_US
dc.citation.volume282en_US
dc.citation.issueen_US
dc.citation.spage575en_US
dc.citation.epage576en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:A1997XZ90500069-
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