INTERMETALLIC FORMATION ON THE FRACTURE OF SN/PB SOLDER AND PD/AG CONDUCTOR INTERFACES

標題:	INTERMETALLIC FORMATION ON THE FRACTURE OF SN/PB SOLDER AND PD/AG CONDUCTOR INTERFACES
作者:	CHIOU, BS LIU, KC DUH, JG PALANISAMY, PS 電控工程研究所 Institute of Electrical and Control Engineering
公開日期:	1-Jun-1990
URI:	http://dx.doi.org/10.1109/33.56156 http://hdl.handle.net/11536/4098
ISSN:	0148-6411
DOI:	10.1109/33.56156
期刊:	IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY
Volume:	13
Issue:	2
起始頁:	267
結束頁:	274
Appears in Collections:	Articles

Files in This Item:

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.