INTERMETALLIC FORMATION ON THE FRACTURE OF SN/PB SOLDER AND PD/AG CONDUCTOR INTERFACES

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DC Field	Value	Language
dc.contributor.author	CHIOU, BS	en_US
dc.contributor.author	LIU, KC	en_US
dc.contributor.author	DUH, JG	en_US
dc.contributor.author	PALANISAMY, PS	en_US
dc.date.accessioned	2014-12-08T15:05:34Z	-
dc.date.available	2014-12-08T15:05:34Z	-
dc.date.issued	1990-06-01	en_US
dc.identifier.issn	0148-6411	en_US
dc.identifier.uri	http://dx.doi.org/10.1109/33.56156	en_US
dc.identifier.uri	http://hdl.handle.net/11536/4098	-
dc.language.iso	en_US	en_US
dc.title	INTERMETALLIC FORMATION ON THE FRACTURE OF SN/PB SOLDER AND PD/AG CONDUCTOR INTERFACES	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1109/33.56156	en_US
dc.identifier.journal	IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY	en_US
dc.citation.volume	13	en_US
dc.citation.issue	2	en_US
dc.citation.spage	267	en_US
dc.citation.epage	274	en_US
dc.contributor.department	電控工程研究所	zh_TW
dc.contributor.department	Institute of Electrical and Control Engineering	en_US
dc.identifier.wosnumber	WOS:A1990DG96600004	-
dc.citation.woscount	22	-
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