覆晶自我校準機構之設計與實現

Abstract

在覆晶製程之中，當晶片結合時晶片面與基板面彼此相對的歪斜可能會造成在晶片面下的凸塊與基板上的襯墊僅有部分的接觸，此部分接觸可能會導致凸塊與襯墊僅有部份的接合或是造成凸塊過度壓擠而發生破裂，影響覆晶封裝的品質。 本研究主要是在設計與實現覆晶機構中平面結合時的自我校準機構，此自我校準機構的設計與實現，讓鑲在晶片上的凸塊與基板上的襯墊就可以均勻的貼合，提升覆晶製程的良率。在自我校準機構的設計之中，使用球面氣體軸承的設計，以球面對來產生兩個轉動自由度以利於平面的對準，利用氣體潤滑的方式，讓基板面移動配合晶片面來達成共平面的狀態。

In bonding process of flip chip, when there is an angle between the chip and the substrate, bonding can only be achieved at one corner or broken bumps to affect package quality of flip chip. The main purpose of this thesis is design a self-alignment system for flip chip devices. It is application of flip chip by self-alignment system to solve an angle between the chip and the substrate. Pads and bumps can contact uniformly and improve package quality of flip chip. In the design of self-alignment, it used the spherical air bearing. The spherical surface can be provided two degree of freedoms to achieve coplanarity. It’s used be a little force that moves substrate to match chip by air lubrication.