标题: 两种含硫醇基添加剂对电镀铜填孔力影响之研究
Effects of Additives Containing Mercapto Group on Copper Electroplating Filling Performances
作者: 张玉尘
林鹏
吴朴伟
材料科学与工程学系
关键字: 电镀铜;添加剂;l硫醇基;Copper Electroplating;Additive;Mercapto Group
公开日期: 2008
摘要: 以6-amino-2-mercaptobenzothiazole及 2-mercapto-
benzothiazole两种含硫醇基的有机化合物分别作为微尺寸铜电镀的添加剂。在具备120nm宽度沟槽的矽晶圆基板上电镀铜,并观察添加剂对填孔能力的影响,同时以AFM观察电镀铜层的表面平整度。
从I-V量测分析,添加6-amino-2-mercaptobenzothiazole配方有较好的加速铜离子还原能力,但此配方在低添加浓度高电镀电流与高添加浓度低电镀电流条件下,无法获得“superfilling”的填孔效果。其中除了添加100 μM 6-amino-2-mercaptobenzothiazole配方于低电流密度电镀下的铜导线试片会出现空孔缺陷,其余配方均可以达成IBM理论中所谓“superfilling”的效果。高添加浓度于高电镀电流条件下电镀,因利于均匀成核故试片表面形貌较平整。
Compounds of 6-amino-2-mercaptobenzothiazole and 2-mercaptobenzothiazole were investigated as chemical additives for Cu electrodeposition in trenches of 120 nm width on Si substrates. The Scanning Electron Microscope was employed to observe the morphologies of the electrodeposited Cu and evaluated the trench-filling abilities of the additives. Electrochemical analysis was conducted to measure their respective reducing performances and Atomic Force Microscope was adopted to record the surface roughness.
From current-potential profiles, the additive of 6-amino-2-mercapto- benzothiazole exhibited an enhanced Cu electrodeposition behavior. Unfortunately, it was not able to deliver the “superfilling” requirement at low concentration/high depositing current, as well as high concentration/low depositing current. For both additives, improved surface characteristics were obtained at high concentration and current density
URI: http://140.113.39.130/cdrfb3/record/nctu/#GT008418520
http://hdl.handle.net/11536/42334
显示于类别:Thesis


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