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dc.contributor.authorCHIOU, BSen_US
dc.date.accessioned2014-12-08T15:05:43Z-
dc.date.available2014-12-08T15:05:43Z-
dc.date.issued1989-12-01en_US
dc.identifier.issn0148-6411en_US
dc.identifier.urihttp://dx.doi.org/10.1109/33.49049en_US
dc.identifier.urihttp://hdl.handle.net/11536/4257-
dc.language.isoen_USen_US
dc.titleDEVELOPMENT OF TEMPERATURE-STABLE THICK-FILM DIELECTRICS .2. MEDIUM-K DIELECTRICen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/33.49049en_US
dc.identifier.journalIEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGYen_US
dc.citation.volume12en_US
dc.citation.issue4en_US
dc.citation.spage798en_US
dc.citation.epage808en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department電控工程研究所zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentInstitute of Electrical and Control Engineeringen_US
dc.identifier.wosnumberWOS:A1989CK70700055-
dc.citation.woscount3-
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