強化晶圓廠5S管理之研究

Abstract

現場管理(Scene management)在晶圓廠是個非常複雜且難以控制的問題。因此晶圓廠管理者引進5S (整理、整頓、清掃、清潔、教養)來處理現場管理。但就實際管理層面－5S管理知易行難且執行成果難以量化。對晶圓廠管理者而言，需執行5S改善的項目是成千上萬(輕則如殘膠，重則如漏油)；但對5S稽核者而言，不論是內稽或外稽，每個5S改善的項目，都很重要且都要已完成(無殘膠，也無漏油)。在晶圓廠現場管理的現況下，5S改善的項目是無上限，但可分配5S改善的資源卻是有限。再者，傳統5S執行的缺點，並無考慮晶圓廠現場的複雜特性，實際在晶圓廠現場管理執行起來，漫無目標更管理不易。因此，本研究首次針對晶圓廠的現場特性，獨創建構專屬晶圓廠的CLEAN架構，藉以控制難以處理的現場管理，並實際列出晶圓廠該執行的改善方向與其對應項目。此首創的CLEAN架構並透過Kano二維品質模式及Kano問卷，在眾多的現場管理的改善要點中，找出客戶認為對晶圓廠而言是重要的管理項目。最後，本CLEAN架構提出了個方法，建構專屬晶圓廠的5S的失效模式與效應分析(Failure modes and effects analysis，FMEA)及其風險優先數(Risk priority number，RPN)，可讓晶圓廠管理者，在內部自我5S稽核時，將5S稽核結果的改善項目分析及排序，幫助晶圓廠未來通過客戶的稽核。因此，本研究可實際應用於晶圓廠，管理者透過CLEAN的架構建立5S管理方針，並於資源有限下，排序地執行5S內稽結果中需改善項目，控制並解決現場管理的棘手問題，解決傳統5S管理的缺點，最後成功通過客戶稽核，進而讓客戶無慮地下訂單。

Scene management of a semiconductor wafer fabrication (fab) was identified as a complex problem. When building a state-of-the-art wafer fab, it was common to find thousands of action items to complete in order to comply with customer (auditor) expectations toward scene management sustained by 5S method. However, the scope of traditional 5S method was too general to cover scene management. This research proposed a framework of CLEAN to deal with scene management. This CLEAN framework, not exclusive to the 5S method, listed 14 critical check points according to fab’s distinct characteristics and intensive literature review. Then, the CLEAN framework applied Ho’s 5S checklist by Kano model to classify quality attributes for 47 5S check points of 5S checklist and to reveal significant 5S check points that customer valued the most with respect to customer voice. Finally, the problem of resource constraints was one of the biggest challenges facing an auditor prior to a new fab released for production when audit preparation was a subject for the 5S readiness of a fab. There was a finite amount of resource for the auditee (fab) while customer was trying to understand the fab’s approach and to ensure that the 5S requirements are compliant. A new method was proposed to apply Failure Modes and Effects Analysis (FMEA) associated with Risk Priority Number (RPN) for quantifing and prioritizng 5S activities of scene management. This method of 5S-FMEA and 5S-RPN was applied to a real wafer fab to demonstrate a convincing result. Hence, a fab manager could sustain scene management for a fab and thereafter ensure order confirmation from customer through the adoption of this proposed CLEAN framework.