完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Bai, Mingsian R. | en_US |
dc.contributor.author | Kuo, Yu-Chih | en_US |
dc.date.accessioned | 2014-12-08T15:06:36Z | - |
dc.date.available | 2014-12-08T15:06:36Z | - |
dc.date.issued | 2010-07-01 | en_US |
dc.identifier.issn | 1549-4950 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/5166 | - |
dc.description.abstract | Faced with various conflicting issues arising from sensitivity, bandwidth, and miniaturization requirements for Bluetooth earphones, it is desirable to develop a systematic way to attain a design that would meet these requirements. Based on a lumped-parameter model, the design of the earphone enclosure is optimized using the simulated annealing (SA) algorithm. Experimental results obtained using a type 3.3 ear simulator, the IEC 60318-4 (which supersedes IEC 60711 in 2010), reveal that the optimized design has resulted in a significant performance enhancement, complying with the frequency response mask dictated in the 3GPP2 standard. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Acoustical Design of a Bluetooth Earphone Using Simulated Annealing Optimization | en_US |
dc.type | Article | en_US |
dc.identifier.journal | JOURNAL OF THE AUDIO ENGINEERING SOCIETY | en_US |
dc.citation.volume | 58 | en_US |
dc.citation.issue | 7-8 | en_US |
dc.citation.spage | 583 | en_US |
dc.citation.epage | 589 | en_US |
dc.contributor.department | 機械工程學系 | zh_TW |
dc.contributor.department | Department of Mechanical Engineering | en_US |
dc.identifier.wosnumber | WOS:000281016500004 | - |
dc.citation.woscount | 2 | - |
顯示於類別: | 期刊論文 |