完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Tsai, C. Y. | en_US |
dc.contributor.author | Chiang, K. C. | en_US |
dc.contributor.author | Lin, S. H. | en_US |
dc.contributor.author | Hsu, K. C. | en_US |
dc.contributor.author | Chi, C. C. | en_US |
dc.contributor.author | Chin, Albert | en_US |
dc.date.accessioned | 2014-12-08T15:06:39Z | - |
dc.date.available | 2014-12-08T15:06:39Z | - |
dc.date.issued | 2010-07-01 | en_US |
dc.identifier.issn | 0741-3106 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1109/LED.2010.2049636 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/5203 | - |
dc.description.abstract | We have fabricated high-k Ni/ZrO(2)/TiN metal-insulator-metal capacitors with a very high 52-fF/mu m(2) capacitance density, a low leakage current of 1.6 x 10(-7) A/cm(2), and good ten-year reliability with a small Delta C/C of 1.7% at 2 V. From X-ray diffraction measurements, laser annealing can improve the permittivity of ZrO(2) due to tetragonal-phase formation which in turn helps enhance capacitance density and reliability. Such excellent device integrity is attributed to the combination of enhanced ZrO(2) tetragonal phase by laser annealing, high work-function Ni electrode, and good bottom-interface treatment. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Improved Capacitance Density and Reliability of High-k Ni/ZrO(2)/TiN MIM Capacitors Using Laser-Annealing Technique | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/LED.2010.2049636 | en_US |
dc.identifier.journal | IEEE ELECTRON DEVICE LETTERS | en_US |
dc.citation.volume | 31 | en_US |
dc.citation.issue | 7 | en_US |
dc.citation.spage | 749 | en_US |
dc.citation.epage | 751 | en_US |
dc.contributor.department | 電機工程學系 | zh_TW |
dc.contributor.department | Department of Electrical and Computer Engineering | en_US |
顯示於類別: | 期刊論文 |