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dc.contributor.authorLin, Chia-Yien_US
dc.contributor.authorHsu, Li-Chungen_US
dc.contributor.authorChen, Hung-Mingen_US
dc.date.accessioned2014-12-08T15:07:21Z-
dc.date.available2014-12-08T15:07:21Z-
dc.date.issued2010-03-01en_US
dc.identifier.issn0916-8524en_US
dc.identifier.urihttp://dx.doi.org/10.1587/transele.E93.C.369en_US
dc.identifier.urihttp://hdl.handle.net/11536/5797-
dc.description.abstractWith the advancement of VLSI manufacturing technology entire electronic systems can be Implemented in a single intergrated circuit Due to the complexity in SoC design. circuit testability becomes one of the most challenging works Without careful planning it Design For Testability (DFT) design, circuits consume mote power in test mode operation than that in normal functional mode This elevated testing power may cause problems including overall yield lost and instant circuit damage In this paper, we present two approaches to minimize scan based DFT power dissipation First methodology Includes routine cost consideration in scan chain reordering after cell placement. while second methodology provides test pattern compression for lower power We formulate the first problem as a Traveling Salesman Problem (TSP). with different cost evaluation from [18],[19] and apply an efficient heuristic to solve it lit the second problem we provide a selective scan chain architecture and perform a simple yet effective encoding scheme for lower scan testing power dissipation The experimental results of ISCAS'89 benchmarks show that the first methodology obtains up to 10% average power saving under the same low routing cost compared with a recent result in [19] The second methodology reduces over 17% of test power compared with filling all don't care (X) bit with 0 in one of ISCAS'89 benchmarks We also provide the integration flow of these two approaches in this paperen_US
dc.language.isoen_USen_US
dc.subjectDFTen_US
dc.subjectTSPen_US
dc.subjecttest poweren_US
dc.titleOn Reducing Test Power, Volume and Routing Cost by Chain Reordering and Test Compression Techniquesen_US
dc.typeArticleen_US
dc.identifier.doi10.1587/transele.E93.C.369en_US
dc.identifier.journalIEICE TRANSACTIONS ON ELECTRONICSen_US
dc.citation.volumeE93Cen_US
dc.citation.issue3en_US
dc.citation.spage369en_US
dc.citation.epage378en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000276760400020-
dc.citation.woscount0-
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