基板上電阻薄膜對封裝微帶線寄生模之衰減效應分析

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DC Field	Value	Language
dc.contributor.author	周詠晃	en_US
dc.contributor.author	Young-Hoang Chou	en_US
dc.contributor.author	鍾世忠	en_US
dc.contributor.author	Dr. Shyh-Jong Chung	en_US
dc.date.accessioned	2014-12-12T02:12:22Z	-
dc.date.available	2014-12-12T02:12:22Z	-
dc.date.issued	1993	en_US
dc.identifier.uri	http://140.113.39.130/cdrfb3/record/nctu/#NT820436042	en_US
dc.identifier.uri	http://hdl.handle.net/11536/58172	-
dc.description.abstract	本論文旨在分析封裝微帶線金屬兩側加電阻性薄膜時,對其混合模傳播特性之影響. 文中我們對 "線方法" (The Method of Lines) 稍加休改,並配合薄膜上之電阻性邊界條件求解. 為驗證分析方法及程式的正確性,首先考慮微帶線 (薄膜電阻為無窮大) 及共面波導 (薄膜電阻為零) 各模態的色散效應, 並與其它方法所得結果比較. 得出驗正後,我們改變薄膜的寬度及電阻值,追蹤主模態及其它高階模態之傳播及衰減特性隨這兩個參數的變化,最後找出能夠有效抑制高階模態但又不影響主模態特性的最佳寬度及電阻的組合.	zh_TW
dc.language.iso	en_US	en_US
dc.subject	寄生模,衰減,電阻薄膜	zh_TW
dc.subject	Parasitic mode, Attenuation, Resistive film	en_US
dc.title	基板上電阻薄膜對封裝微帶線寄生模之衰減效應分析	zh_TW
dc.title	Attenuation of the parasitic modes in a shielded microstrip line by coating resistive films on the substrate.	en_US
dc.type	Thesis	en_US
dc.contributor.department	電信工程研究所	zh_TW
Appears in Collections:	Thesis