聚亞醯胺前驅物和氧化銅界面間化學及接著之研究

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	歐育榮	en_US
dc.contributor.author	Ou Yu Jung	en_US
dc.contributor.author	張豐志;蔡文賢	en_US
dc.contributor.author	Chang Feng Chih ,Tsai Wen Hsien	en_US
dc.date.accessioned	2014-12-12T02:12:42Z	-
dc.date.available	2014-12-12T02:12:42Z	-
dc.date.issued	1993	en_US
dc.identifier.uri	http://140.113.39.130/cdrfb3/record/nctu/#NT820500034	en_US
dc.identifier.uri	http://hdl.handle.net/11536/58419	-
dc.description.abstract	本研究的終極目標是希望經由銅與聚亞醯胺界面的研究,建立界面微結構與巨觀接著強度之相關性,進而對銅與聚亞醯胺實際接著應用上有所助益.	zh_TW
dc.language.iso	zh_TW	en_US
dc.subject	聚亞醯胺;硬化;前驅物	zh_TW
dc.subject	polyimide;curing;precursor	en_US
dc.title	聚亞醯胺前驅物和氧化銅界面間化學及接著之研究	zh_TW
dc.title	Interfacial Studies between Cured Polyamic Acids of BPDA-PDA Polyimides and Copper Oxides	en_US
dc.type	Thesis	en_US
dc.contributor.department	應用化學系碩博士班	zh_TW
顯示於類別：	畢業論文