多孔矽的製作與特性探討

Abstract

本論文研究方向在於探討多孔矽的形成及其基本特性。由熱傳量測結果顯 示，熱導率為2.8W/m•℃，比單晶矽低53倍。利用多孔矽熱導低的特性， 可應用在熱型微感測元件的熱絕緣薄板上。使用多孔矽做成的熱感測元件 ，應可以降低應力及提高良率。 To perform the fabriaction and characterization of porous silicon is the goal of this thesis. In experiment, we find that the thermal conductivity of porous silicon is 2.8 W/m•℃ ,which is as smaller as a factor of 53 than crystalline silicon. Hence, the porous silicon can be used as a isolating plate in thermal microsensors. Using this technique, a thermal pad with lower stress and higher yield will be achieved.