| 標題: | 衡量國家技術能力之研究:以兩岸技術能力比較為例 A study of measuring technological strength of the R. O. C. and the P. R. C |
| 作者: | 劉俊儀 Liu, Jun Yi 袁建中 Yuan, Jian Zhong 科技管理研究所 |
| 公開日期: | 1994 |
| URI: | http://140.113.39.130/cdrfb3/record/nctu/#NT832230014 http://hdl.handle.net/11536/59711 |
| Appears in Collections: | Thesis |
- Measurement of Temperature Distribution in SnAg3.5 Flip-Chip Solder Joints during Current Stressing Using Infrared Microscopy / Hsiao, Hsiang-Yao;Chen, Chih
- The Analysis and Development of Taiwan's Industrial Logistics Hubs / Trappey, Charles V.;Trappey, Amy J. C.;Lin, Gilbert Y. P.;Liu, C. S.;Lee, W. T.
- Kinetic study of eutectic Sn-3.5Ag and Electroplated Ni metallization in flip-chip solder joints / Chen, Hsiao-Yun;Chen, Chih
- Measurement of Temperature Distribution in SnAg3.5 Flip-Chip Solder Joints during Current Stressing Using Infrared Microscopy / Hsiao, Hsiang-Yao;Chen, Chih
- Temperature dependence of azimuthal anchoring strength of liquid crystals on microgrooved glass substrate / Lin, YF;Lu, SY;Pan, RP
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