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dc.contributor.authorWu, Yu-Liehen_US
dc.contributor.authorYang, Kai-Shingen_US
dc.contributor.authorChen, Min-Yien_US
dc.contributor.authorWang, Chi-Chuanen_US
dc.date.accessioned2014-12-08T15:07:50Z-
dc.date.available2014-12-08T15:07:50Z-
dc.date.issued2010-01-01en_US
dc.identifier.issn1078-9669en_US
dc.identifier.urihttp://hdl.handle.net/11536/6162-
dc.description.abstractA novel cooling design featuring a two-stage expansion process is proposed in this study. Without any help from insulation, the design can minimize or even entirely eliminate condensate formation outside the cold-plate surface even for a very low evaporation temperature. The design incorporates a double-pipe inlet/outlet and a two-container cold plate, and its performance is compared to a conventional cold plate. For the conventional cold plate, the outlet pressure/temperature hold quite steadily at a light heat load, and the outlet pressure/temperature shows a substantial rise when the refrigerant is completely evaporated. The outlet pressure/temperature of the condensate-free cold plate shows an opposite trend at a heavy heat loading. The benefit of this characteristic is that the wall surface temperature and the outlet temperature of the cold plate can be maintained comparatively more steady than the conventional cold plate.en_US
dc.language.isoen_USen_US
dc.titleA Novel Condensate-Free Refrigerated Cold Plate for Electronic Coolingen_US
dc.typeArticleen_US
dc.identifier.journalHVAC&R RESEARCHen_US
dc.citation.volume16en_US
dc.citation.issue1en_US
dc.citation.spage3en_US
dc.citation.epage14en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000275813200002-
dc.citation.woscount0-
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