電路板熱傳播漸進等效電路的發展與其在SPICE上程式庫之建立

Abstract

本論文使用有限差分法近似熱傳播偏微分等式，並將其等效地類比成電路 形式，建構電路板與積體電路元件熱傳播的電路模型。在電路板熱模型方 面，我們亦將銅膜繞線列入考慮。而在積體電路元件熱模型方面，我們則 發展漸進簡化模型的方法，將原先建立的多層立體電路模型簡化成單層平 面的等效電路模型，以節省大量模擬時間與記憶體空間。我們並以此漸進 簡化模型在SPICE上建立元件程式庫，讓我們可依據不同精確度及簡化程 度的需求而選擇不同的漸進簡化模型，以達到模組化的目的。 In this thesis, the partial differential equations for computing heat transferin PCB's and IC packages are approximated by using the finite difference method. We have proposed efficient equivalent circuit models to simulate the heat transfer mechanism of PCB's and IC's. We have also considered the complicate wiring models of PCB's in our simulation. In the modeling of IC's, we also pro-posed the asymptotic equivalent method to transfer the traditional three dimen-sion equivalent circuits of IC's into two dimension asymptotic equivalent cir- cuits. With the usage of this method, the simulation computation time and com-puter memory size can be reduced greatly. The asymptotic equivalent network ofIC's are used to build the library models designed in SPICE. According to ourconsideration of the accuracy, we can determine the order of simplified modelsi.e. different asymptotic equivalent models.