標題: | 用於極大型積體電路金屬導線間之旋覆式低介電質常數材料之物性和電性 Physical and Electrical Properties of Spin-On Low Dielectric Constant Materials for ULSI Intermetal Dielectric Applications |
作者: | 江雲祺 Jiang, Yun-Chi 曾俊元, 孫喜眾 Tseung-Yuen Tseng, Shi-Chung Sun 電子研究所 |
關鍵字: | 低介電質常數;旋覆式;Low Dielectric Constant;Spin-On |
公開日期: | 1996 |
摘要: | 在本論文中,我們對五種旋覆式(spin-on)低介電質常數材料作了物性和 電性的分析。在物性方面主要是利用薄膜應力量測系統和FTIR來探討它的 吸水性和熱穩定性。我們發現含氟的聚合物在這兩方面的特性都要比只含 碳和氫的聚合物來得好,而只含氫的要比含碳氫的好些。在電性方面主要 是探討漏電流、崩潰電壓和介電質常數。在電性方面也是含氟的聚合物比 較好,但附著性較差。除此之外我們也做了低介電質常數材料在銅金屬化 上的研討,FOX-15 在沒有擴散障礙層時,只要對銅做350oC熱化處理,電 容的漏電即大幅增加!而PAE-2材料對銅的擴散抗力較佳。若加上擴散障 礙層的幫助,兩者均有不錯的電性。 In this thesis, we explore five different kinds of spin-on low dielectric constant materials. We characterize their physical and electrical properties. In physical properties, we focus on film moisture absorbance and thermal stability. We use thin film stress measurement system and FTIR to understand their properties. We find that fluorinated polymers have better characteristics.In electrical properties, we explore the leakage current, breakdown field, and dielectric constant. Fluorinated polymers have lower leakage current, higher breakdown, and lower dielectric constant but the film adhesion on silicon or oxide is poor. We also explore the effect of copper on low dielectric film. Without barrier metal, FOX-15 is very leak after 350 oC anneal. Without barrier metal, PAE-2 cured at 500 oC can withstand Cu diffusion up to 400 oC anneal. With diffusion barriers, the thermal stability can reach 500 oC. |
URI: | http://140.113.39.130/cdrfb3/record/nctu/#NT850428100 http://hdl.handle.net/11536/61973 |
顯示於類別: | 畢業論文 |