完整後設資料紀錄
DC 欄位 | 值 | 語言 |
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dc.contributor.author | Liang, Yuan-Chang | en_US |
dc.contributor.author | Lee, Hsin-Yi | en_US |
dc.date.accessioned | 2014-12-08T15:07:54Z | - |
dc.date.available | 2014-12-08T15:07:54Z | - |
dc.date.issued | 2010 | en_US |
dc.identifier.issn | 1466-8033 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/6220 | - |
dc.identifier.uri | http://dx.doi.org/10.1039/c004452k | en_US |
dc.description.abstract | Zr-doped In(2)O(3) (Zr-In(2)O(3)) (222) epitaxial layers of thickness 210 nm were grown on yttria-stabilized zirconia (YSZ) (111) and Al(2)O(3) (0001) substrates with rf magnetron sputtering at 350 degrees C in an atmosphere deficient in oxygen. X-Ray scattering and use of a transmission electron microscope (TEM) revealed Zr-In(2)O(3) films to be deposited epitaxially on YSZ (111) and Al(2)O(3) (0001). Images observed with an atomic-force microscope demonstrate that the substrate profoundly affected the topography of the Zr-In(2)O(3) (222) epilayers. The large mismatch of the Zr-Al(2)O(3) (222)/Al(2)O(3) (0001) heteroepitaxy was responsible for the surface structure of the epilayer being rougher than that on YSZ (111). Cross-sectional TEM images reveal dense crystalline films with no macroscopic imperfection; the crystalline order of Zr-In(2)O(3) epilayers is preserved up to the top surface. The Zr-In(2)O(3) (222)/YSZ (111) heteroepitaxy has a Hall mobility greater than that of Zr-In(2)O(3) (222)/Al(2)O(3) (0001), perhaps due to the greater lattice mismatch of the Zr-In(2)O(3) (222)/Al(2)O(3) (0001) heteroepitaxy that results in Zr-In(2)O(3) having a poor crystalline quality. Domain boundaries on a nanometre scale were found in the heteroepitaxial Zr-In(2)O(3) (222)/Al(2)O(3) (0001) resulting from random nucleation and relaxation of misfit stress. The existence of these domain boundaries on a nanometre scale thus affects the electrical properties of the Zr-In(2)O(3) epilayer. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Growth of epitaxial zirconium-doped indium oxide (222) at low temperature by rf sputtering | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1039/c004452k | en_US |
dc.identifier.journal | CRYSTENGCOMM | en_US |
dc.citation.volume | 12 | en_US |
dc.citation.issue | 10 | en_US |
dc.citation.spage | 3172 | en_US |
dc.citation.epage | 3176 | en_US |
dc.contributor.department | 材料科學與工程學系 | zh_TW |
dc.contributor.department | Department of Materials Science and Engineering | en_US |
dc.identifier.wosnumber | WOS:000282219100078 | - |
dc.citation.woscount | 12 | - |
顯示於類別: | 期刊論文 |