新型三官能基含矽環氧單體合成及其在難燃材料上之應用

Abstract

是酸酐類硬化劑進行硬化，其所生成之含矽環氧樹脂系統，均呈現出單一相行為，藉同表面元素分析可發現硬化後環氧樹脂系統中，其含矽團基於系統中呈現均勻分佈，並無相分離的情形發生。而上述摻混系統的熱行為及難燃特性，亦藉由TGA、Py-GC/MS與TGA-GC/MS分別由巨觀與微觀進行探討，結果發現，摻混系統不論以何種硬化劑進行硬化，其難燃性均隨著系統中矽含量的增加而提高。

A new silicon-containing oxirane triglycidyl phenyl silane oxide (TGPSO) and its corresponding silicon-containing epoxy resins are synthesized and characterized. The activation energies of TGPSO curing reaction with various curing agents, including 4,4-diaminodiphenylmethane (DDM), 4,4-diaminodiphenylsulfone (DDS) and dicyanodiaminde (DICY) are found to be 180, 196.5 and 154kj/mol. The curing reation of TGPSO with diamines are determined to be first order reaction through means of Arrhenius plots. The introduction of silicon-containing oxirane compared with Epon 828, Eponex 1015, and DER 732 showed relatively high char yield as well as higher limiting oxygen index (LOI = 35) than the commercial epoxy resins, confirming the usefulness of these silicon-containing epoxy resins as flame retardant. Chat yields and LOI measurements demonstrate that incorporating silicon into epoxy resins is able to improve their flame retardancy. Thermal degradation mechanism of TGPSO was studied by pyrolysis gas chromatograpy/Mass spectrometry (PGC/MS) and thermogravimetric analysis gas chromatograpy/Mass spectrometry. The most major pyrolysates of TGPSO are found to be benzene, toluene and CO2 by the PG/MS.