完整後設資料紀錄
DC 欄位語言
dc.contributor.author閻聖春en_US
dc.contributor.authorSheng-Chun Yenen_US
dc.contributor.author羅正忠en_US
dc.contributor.authorJen-Chung Louen_US
dc.date.accessioned2014-12-12T02:20:45Z-
dc.date.available2014-12-12T02:20:45Z-
dc.date.issued1998en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#NT870428038en_US
dc.identifier.urihttp://hdl.handle.net/11536/64321-
dc.description.abstract為了能得到更好的解析度,在深次微米中的微影製程中,多層光阻的使用乃是不可或缺的。由於薄膜中光學干涉的效應,光阻的曝光後的輪廓會有震盪(swing) 的情形,通常使用曝後烤(Post Exposure Bake)加以避免;然而曝後烤往往會增加臨界寬度(Critical Dimension),因而減少解析度。多層光阻的使用可以有效改進上述缺點。 多層光阻的使用需要精巧地控制許多變數,為了達到最佳化的效果,必須使用電腦模擬以減少時間與金錢的消耗,因此模擬軟體佔了相當重要的地位。我們發展了一套微影製程的模擬程式,可以精確計算光在薄膜中干涉的行為。利用這套軟體,可以最佳化使用多層光阻所需的眾多參數。在此篇論文中,我們討論了光學干涉行為以及利用不同的晶原結構,示範計算的結果。zh_TW
dc.description.abstractTo get better resolution, in deep sub-micron lithography process, the use of multi-layer photo-resist is necessary. Because of optical interference in thin film, the shape of exposed resist has so-called swing effect. Usually, PEB (Post Exposure Bake) used to be applied to avoid this effect. However, PEB may increase CD (Critical Dimension control) and degrade the resolution. Multi-layer resist can be prevailing over this effect. In using of this process, there are lots of parameters should be elaborately controlled. To optimize these factors, simulation in computer plays a very important role to decrease the cost of time and money. We build a model to precisely calculate the optical behavior in resists to optimize many parameters which is needed in applying multi-layer resists method. In this paper, we discuss optical interference in thin film and some results from different structure are given for examples.en_US
dc.language.isoen_USen_US
dc.subject多層膜zh_TW
dc.subject微影zh_TW
dc.subject半導體製程zh_TW
dc.subjectARLen_US
dc.subjectantireflection layeren_US
dc.subjectmicrolithographyen_US
dc.subjectmultilayer photoresisten_US
dc.subjectsimulationen_US
dc.title微影製程中多層光阻的模擬與研究zh_TW
dc.titleSimulation and Study on Multi-layer Photoresist in Microlithographyen_US
dc.typeThesisen_US
dc.contributor.department電子研究所zh_TW
顯示於類別:畢業論文