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dc.contributor.authorLin, Hong-Chingen_US
dc.contributor.authorLin, Pangen_US
dc.contributor.authorLu, Chun-Anen_US
dc.contributor.authorWang, Sea-Fueen_US
dc.date.accessioned2014-12-08T15:08:25Z-
dc.date.available2014-12-08T15:08:25Z-
dc.date.issued2009-11-01en_US
dc.identifier.issn0167-9317en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.mee.2009.04.010en_US
dc.identifier.urihttp://hdl.handle.net/11536/6514-
dc.description.abstractIn this paper, the effect of silver oxalate addition on physical characteristics of metallo-organic-decomposition (MOD) silver screen-printable paste for thick film technology was investigated. The addition of silver oxalate in the paste not only produces fresh fine silver particles after curing, but also reduces the decomposition temperature of the lubricant coated on the silver flakes. This is an effective route to provide fine silver particles to the paste without significantly changing the theological behavior. At the curing temperature of 225 degrees C, the resistivity decreases from 180.1 to 31.9 mu Omega-cm, as the silver oxalate content increases from 0 to 10 wt%. This is due to the fact that active silver catalysts produced increase the packing density of silver flakes, and also the removal of lubricant from the surface of silver flakes enhances the electrical conductivity, thereby decreasing the resistance of film. (C) 2009 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectSilver pasteen_US
dc.subjectMetallo-organic-decompositionen_US
dc.subjectSilver oxalateen_US
dc.titleEffects of silver oxalate additions on the physical characteristics of low-temperature-curing MOD silver paste for thick-film applicationsen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.mee.2009.04.010en_US
dc.identifier.journalMICROELECTRONIC ENGINEERINGen_US
dc.citation.volume86en_US
dc.citation.issue11en_US
dc.citation.spage2316en_US
dc.citation.epage2319en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000271363900033-
dc.citation.woscount1-
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