Assembly of Micro-3-D Components on SOI Wafers Using Novel SU-8 Locking Mechanisms and Vertical One-Push Operation

doi:10.1109/JSTQE.2009.2018478

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Chiu, Yi	en_US
dc.contributor.author	Wu, Chang-Shiou	en_US
dc.contributor.author	Huang, Wei-Zhi	en_US
dc.contributor.author	Wu, Jhong-Wei	en_US
dc.date.accessioned	2014-12-08T15:08:54Z	-
dc.date.available	2014-12-08T15:08:54Z	-
dc.date.issued	2009-09-01	en_US
dc.identifier.issn	1077-260X	en_US
dc.identifier.uri	http://dx.doi.org/10.1109/JSTQE.2009.2018478	en_US
dc.identifier.uri	http://hdl.handle.net/11536/6776	-
dc.description.abstract	A novel out-of-plane assembly technique of 3-D microstructures is proposed and demonstrated by using simple vertical one-push operations. This one-push method has large probe positioning tolerance in both vertical and lateral directions to reduce the overall complexity of the assembly process. Micromirrors and corner cube reflectors are fabricated on silicon-on-insulator wafers using SU-8 photoresist as a second structure layer in a low-temperature process. Batch assembly of multiple mirrors assembled simultaneously is demonstrated.	en_US
dc.language.iso	en_US	en_US
dc.subject	Assembly	en_US
dc.subject	hinge	en_US
dc.subject	microelectromechanical system (MEMS)	en_US
dc.subject	one push	en_US
dc.subject	out of plane	en_US
dc.title	Assembly of Micro-3-D Components on SOI Wafers Using Novel SU-8 Locking Mechanisms and Vertical One-Push Operation	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1109/JSTQE.2009.2018478	en_US
dc.identifier.journal	IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS	en_US
dc.citation.volume	15	en_US
dc.citation.issue	5	en_US
dc.citation.spage	1338	en_US
dc.citation.epage	1343	en_US
dc.contributor.department	電控工程研究所	zh_TW
dc.contributor.department	Institute of Electrical and Control Engineering	en_US
dc.identifier.wosnumber	WOS:000270950300007	-
dc.citation.woscount	2	-
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