含矽氧烷及亞醯胺改質之環氧樹脂的特性研究

Abstract

本實驗合成含矽氧烷之雙酸酐（Ⅰ），利用上述酸酐化合物改質成含矽氧烷之雙羥基硬化劑（Ⅱ）與含矽氧烷之環氧樹脂（Ⅲ）。上述硬化劑（Ⅱ）與DGEBA 828依不同當量比進行交聯。再者，將含矽氧烷之環氧樹脂（Ⅲ）與雙胺類硬化劑MDA依不同當量比進行交聯。這些不同的配方比例可做出六組交聯產物。對於六組交聯薄膜試片進行一系列的熱性質、介電性質、機械性質、黏著強度、薄膜表面性質測試，並相互比較其結果。在熱性質與機械性質方面，主鏈中以芳香環類結構為主之DGEBA 828╱Ⅱ交聯產物優於以矽氧烷結構為主之環氧樹脂Ⅲ╱MDA的系統。另一方面，導入矽氧烷的硬化劑與環氧樹脂在交聯後的六組試片其介電常數皆在2.8左右，與傳統的環氧樹脂相比確實有顯著的改變，吸濕率為0.5％至0.8％也證明了疏水性的矽氧烷導入交聯系統後，對於吸濕率及介電性質都有良好的影響。

Siloxane-containing dianhydride (I) were synthesized. Its derivatives containing dihydroxyl curing agent (II) and containing epoxy (III) based on structure (I) were also prepared. Various epoxy equivalent weight (EEW) ratios of DGEBA 828╱II for 1/1 , 1/0.8 , 1/0.6 and Ⅲ╱MDA for 1/1 , 1/0.8 , 1/0.6 were mixed and cured to give six products . A series of properties related to electronic packaging capability which include thermal properties, dielectric constants, mechanical properties, adhesions, environmental resistances, etc. were evaluated and characterized. Experimental result revealed that DGEBA 828╱II indicated better thermal and mechanical properties than III/MDA. In addition, the siloxane-containing product showed a dielectric contant of 2.8（at 1MHz）, much lower than the other general purpose epoxy system. Low moisture absorption of 0.5 % to 0.8 % supporting the fact that incorporation of siloxane moiety in the epoxy signifycantly improve the electric properties and moisture absorption.