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dc.contributor.author謝旻芳en_US
dc.contributor.authorMinFang Hsiehen_US
dc.contributor.author張志揚en_US
dc.contributor.authorChi-Yang Changen_US
dc.date.accessioned2014-12-12T02:31:00Z-
dc.date.available2014-12-12T02:31:00Z-
dc.date.issued2002en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#NT910435080en_US
dc.identifier.urihttp://hdl.handle.net/11536/70615-
dc.description.abstract在本論文中,我們利用多層化薄膜技術 ( MCM-D )實現多種指向性耦合器;包括Branch Line耦合器、對稱多節寬頻耦合器以及Rat Race Ring 耦合器。 我們將在論文中提到,如何決定耦合器的原始結構及薄膜多層架構.另外我們也探討了Re-entrant 結構以及如何改善電路的指向性。最後並比較交錯柵形耦合器與薄膜多層耦合器的尺寸及製程以驗證多層薄膜技術的縮小化優異性.量測結果均與設計及模擬結果吻合。zh_TW
dc.description.abstractMulti-layer thin-film (MCM-D) technology is used in this thesis to develop various kinds of directional couplers. The circuit includes branch-line coupler, symmetrical multi-section broadband coupler, and rat-race ring coupler. Determination of the primordial and the thin-film multiplayer structures of the couplers will be studied in this thesis. The re-entrant structure for tight coupler and the improvement of directivity of the coupler will also be discussed. Finally, we will compare the circuit size between the interdigital coupler and the multi-layer thin-film coupler. The smaller size verifies the superiority of circuit miniaturization using multi-layer thin-film technology. All measurement results correlate well with simulated results.en_US
dc.language.isozh_TWen_US
dc.subject薄膜製程zh_TW
dc.subject微型化zh_TW
dc.subject指向性耦合器zh_TW
dc.subject步階式組抗傳輸線zh_TW
dc.subject基偶模組抗zh_TW
dc.subject置入式結構zh_TW
dc.subject寬頻耦合器zh_TW
dc.subject指向性zh_TW
dc.subjectthin film fabricationen_US
dc.subjectminiaturizeden_US
dc.subjectdirectional couplersen_US
dc.subjectstepped impedance transmission lineen_US
dc.subjecteven- odd- mode impedancesen_US
dc.subjectRe-entrant structureen_US
dc.subjectbroadband coupleren_US
dc.subjectdirectivityen_US
dc.title利用薄膜製程設計開發多層微型化指向性耦合器zh_TW
dc.titleStudy of Multi-layer Miniaturized Directional Couplers Using Thin-film Fabricationen_US
dc.typeThesisen_US
dc.contributor.department電信工程研究所zh_TW
顯示於類別:畢業論文