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dc.contributor.authorChen, Shih-Hungen_US
dc.contributor.authorKer, Ming-Douen_US
dc.date.accessioned2014-12-08T15:09:34Z-
dc.date.available2014-12-08T15:09:34Z-
dc.date.issued2009-05-01en_US
dc.identifier.issn1549-7747en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TCSII.2009.2019164en_US
dc.identifier.urihttp://hdl.handle.net/11536/7318-
dc.description.abstractThe RC-based power-rail electrostatic-discharge (ESD) clamp circuit with big field-effect transistor (BigFET) layout style in the main ESD clamp n-channel metal-oxide-semiconductor (NMOS) transistor was widely used to enhance the ESD robustness of a CMOS IC fabricated in advanced CMOS processes. To further reduce the occupied layout area of the RC in the power-rail ESD clamp circuit, a new ESD-transient detection-circuit realized with smaller capacitance has been proposed and verified in a 0.13-mu m CMOS process. From the experimental results, the power-rail ESD clamp circuit with the new proposed ESD-transient detection circuit can achieve a long-enough turn-on duration and higher ESD robustness under ESD stress condition, as well as better immunity against mistrigger and latch-on event under the fast-power-on condition.en_US
dc.language.isoen_USen_US
dc.subjectElectrostatic dischargeen_US
dc.subjectESD protection designen_US
dc.subjectESD-transient detection circuiten_US
dc.subjectpower-rail ESD clamp circuiten_US
dc.titleArea-Efficient ESD-Transient Detection Circuit With Smaller Capacitance for On-Chip Power-Rail ESD Protection in CMOS ICsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TCSII.2009.2019164en_US
dc.identifier.journalIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFSen_US
dc.citation.volume56en_US
dc.citation.issue5en_US
dc.citation.spage359en_US
dc.citation.epage363en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000266331400006-
dc.citation.woscount9-
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