標題: | Hybrid-mode computation of propagation and attenuation characteristics of parallel coupled microstrips with finite metallization thickness |
作者: | Kuo, JT Itoh, T 電信工程研究所 Institute of Communications Engineering |
關鍵字: | attenuation;metallization;microstrip;spectral domain analysis |
公開日期: | 1-二月-1997 |
摘要: | The hybrid-mode mixed spectral domain approach (MSDA) is formulated to investigate the dispersion nature of multiple coupled microstrip lines with arbitrary metallization thickness, Incorporated into the solution procedure, a new set of basis functions with delta(-1/3) field singularity near conductor edges is found to be effective in calculating both the phase and attenuation constants, The computation of conductor loss is based on the perturbation procedure, Over a broad band of frequency spectrum, excellent agreement is obtained between the calculated results and existing experiment data for the metallic losses of a single microstrip and effective dielectric constants of coupled lines, The influence of finite metallization thickness on the frequency dependent modal propagation and attenuation characteristics is presented for both a three-line and four-line structure. |
URI: | http://dx.doi.org/10.1109/22.557610 http://hdl.handle.net/11536/735 |
ISSN: | 0018-9480 |
DOI: | 10.1109/22.557610 |
期刊: | IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES |
Volume: | 45 |
Issue: | 2 |
起始頁: | 274 |
結束頁: | 280 |
顯示於類別: | 期刊論文 |